Conference · hybrid
IEEE REPP Symposium 2026 (Reliability for Electronics and Photonics Packaging)
·UCLA, Los Angeles, CA
Symposium on reliability, failure modes and testing for electronics and silicon-photonics packaging, themed on advanced semiconductor packaging.
- Who it's for
- Engineers and scientists working on electronics and photonics packaging reliability
- Approx. size
- Not published
- Organizer
- IEEE
- Year started
- Unknown
- Price
- Full pass
Expired: Non-member (in person): $90 until Oct 16, 2026
Prices checked Oct 22, 2026 on events.vtools.ieee.org.
- Electronics & Semiconductors
- packaging reliability
- photonics
- semiconductor packaging
Dates and venue checked against the official site on Oct 22, 2026.